City Desk :
The 3rd IEEE International Conference on Robotics, Automation, Artificial Intelligence, and Internet of Things (RAAICON 2024) successfully hosted at the Institute of Robotics and Automation, BUET (IRAB) from November 29 to 30.
The conference brought together esteemed researchers, industry leaders and young professionals to discuss advancements in robotics, AI, IoT, and automation. Since its inception in 2019, RAAICON has grown into a premier platform for fostering collaboration and innovation in these critical fields said a Press Release.
The conference was supported by the IEEE Bangladesh Section and the IEEE Robotics and Automation Society (RAS) Bangladesh Chapter. This year, the conference received 169 research papers, of which all 58 accepted high- quality papers were presented based on a peer review process. The diverse topics covered included robotics applications, AI innovations, IoT solutions and Automation Technologies providing attendees with an enriching academic experience.
This year the event included total nine Technical Sessions and four co-located programs: the IEEE WIE BD Summit 2024 on Robotics for Climate Change and Assistive Technologies, the IEEE Young Professional Congress 2024, Robotics Competition and Project Showcasing organized by BUET Robotics Society (BRS) and an Industrial Technical Seminar addressing the challenges of robotics and automation in Bangladesh.
The conference featured three Keynote Talks from Prof. Darwin G. Cardwell, Fellow of IEEE and Founding Director of the Italian Institute of Technology (IIT), Genoa, Italy; Prof. Ravinder S. Dahiya, Fellow of IEEE and Professor at Northeastern University, USA; and Prof. Lionel P. Robert Jr., Professor at the School of Information, College of Engineering, USA and included two Invited speakers as Dr. Kazi Arafat Rahman, Associate Professor of department of Mechanical Engineering, BUET and Dr. Arjon Turnip, Department of Electrical Engineering, Universitas Padjadjaran, Indonesia. Around 200 attendees were present as audience in this conference.
